Wide Temperature X86 Industrial Mainboard, Low Power Intel x86 System with DDR4 RAM
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Product Introduction
3.5-inch motherboard, with onboard Alder Lake-N/Twin Lake/ Amston Lake series processors.
Intel Alder Lake-N/Twin Lake/ Amston Lake series processors
» Supports up to 32GB DDR4 SO-DIMM memory, frequency 2133/2666/ 3200MHz
» Integrated Intel 12th Gen Xe LP Graphics Core
» Supports two HDMI ports, LVDS ( 18/24- bit single or dual-channel) , or EDP.
» Supports dual 2.5G Ethernet, SATA, and NVMe SSDs
» Supports USB 2.0 and USB 3.0 , serial port, GPIO interface, TPM
Input voltage : +9V~+36V , + 12V recommended.
» Operating temperature: -20 ° C to + 60 °C (optional -40°C to + 75 °C )
Technical Information
| Plate type | 3.5-inch motherboard |
| Processor | Supports Intel Alder Lake-N / Twin Lake / Amston Lake series, including: Intel N95, 4C4T, up to 3.4 GHz, 16 EU iGPU, TDP: 15W Intel N97, 4C4T, up to 3.6 GHz, 24 EU iGPU, TDP: 12W Intel N100, 4C4T, up to 3.4 GHz, 24 EU iGPU, TDP: 6W Intel N200, 4C4T, up to 3.7 GHz, 32 EU iGPU, TDP: 6W Intel Core i3 N300, 8C8T, up to 3.8 GHz, 32 EU iGPU, TDP: 7W Intel Core i3 N305, 8C8T, up to 3.8 GHz, 32 EU iGPU, TDP: 15W Intel Atom X7425E, 4 cores and 4 processors, up to 3.4 GHz, 24 EU iGPU, TDP: 12W Intel N150, 4C4T, up to 3.6 GHz, 24 EU iGPU, TDP: 6W Intel N250, 4C4T, up to 3.8 GHz, 32 EU iGPU, TDP: 6W Intel Core i3 N350, 8C8T, up to 3.9 GHz, 32 EU iGPU, TDP: 7W Intel Core i3 N355, 8C8T, up to 3.9 GHz, 32 EU iGPU, TDP: 15W Intel Atom X7211RE, 2C2T, up to 3.2 GHz, 16 EU iGPU, TDP: 6W Intel Atom X7213RE, 2C2T, up to 3.4 GHz, 16 EU iGPU, TDP: 9W Intel Atom X7433RE, 4C4T, up to 3.4 GHz, 32 EU iGPU, TDP: 9W Intel Atom X7835RE, 8C8T, up to 3.6 GHz, 32 EU iGPU, TDP: 12W |
| Memory | Supports one SO-DIMM DDR4 memory module, up to 32GB, with frequencies of 2133/2666/3200MHz. |
| Graphics processing | Supports two HDMI ports with a maximum resolution of 3840x2160 @ 60Hz; Supports one 18/24-bit single-channel or dual-channel LVDS/EDP, with a maximum resolution of 1920x1080 @ 60Hz. |
| Network card | Supports two 10/100/1000/2500 Mbit Ethernet ports (I226V). |
| Storage | Supports one SATA 3.0 interface and one M.2 SSD (M-Key 2280 SSD NVMe/NGFF). |
| mPCIe | Supports one M.2 WIFI port (E-Key 2230 PCIe x1 & USB2.0) Supports one M.2 4G/5G port (B-Key 3042/3052 USB2.0) |
| USB | Supports 4 front-panel USB 3.0/2.0 ports and 2 internal USB 2.0 ports. |
| Serial port | Supports 6 RS232 (3-wire) ports, with COM1 and COM2 selectable between RS232/422/485. |
| IO | Supports 8 GPIOs, 1 SIM card slot, and 1 TPM socket. |
| Sound card | ALC662/ALC897 High-Fidelity Sound Card (Line-in, Line-out, Mic-in) |
| Power supply | +9V~+36V, +12V is recommended. |
| Temperature | Operating temperature: -20°C to +60°C (optional: -40°C to +75°C) |
| Size | 146 mm x 102 mm |
| Heat dissipation | Fan cooling |
| Operating system | Windows 10, Windows 11, Linux |
FAQ
Q1: What networking upgrade makes PCM-ADN352 stand out among our 3.5-inch boards?
A: It equips dual Intel I226V 2.5G Ethernet ports instead of common Gigabit LAN, delivering faster data transmission for high-throughput machine vision and industrial gateway data collection.
Q2: What power and security highlights does it carry?
A: Unique 9–36V ultra-wide DC input fits vehicle and charging pile power supplies. A dedicated TPM socket adds hardware encryption to secure industrial confidential data, rarely seen on low-power embedded boards.
Q3: Cooling and display advantages?
A: It adopts active fan cooling to sustain stable performance of high-core Alder Lake-N CPUs. Dual HDMI 4K outputs plus LVDS/eDP triple display meet multi-screen monitoring demands.
Q4: Brand and target scenarios?
A: Developed by Shenzhen YDSTECH with max 32GB DDR4 memory. Optimized for ITS, EV charging stations, smart grid and edge AI computing that require high bandwidth and data security.